 | China Circuit Technology (Shantou) Corporation | | Product Detail | PCB | Description:
| Product Class : Printed Circuit Board·Dual-Sided/Multilayer PCB
We offer the following product structures：
1. Double-sided board
2. Conventional multi-layer board
3. Conventional multi-layer board with blind and buried holes:including 3+3, 2+2+2, 4+4, 2+4 etc. This type of PCB isfeatured with all blind, buried and through holes formedby mechanical drilling or blind holes formed by mechanicaland laser drilling.
4. Build-up multi-layer board (BUM):Multi-layer PCB for which RCC or copper and dielectriclayer are applied over conventional double-sided or multi-layer PCB and laser drilling is used. The build-uplayer thickness is equal to or less than 0.15mm (0.006inch). This type of PCB includes 1+n+1 and 1+1+n+1+1.
We offer the following surface finishes：
1. Hot air solder leveling: Alayer of tin or tin lead is applied on bare copper of PCB after soldermask so as to ensure good soldering of components. HASL has goodsolderability.
2. Immersion gold:A layer of nickel and gold is immersed on bare copper of PCB bychemical reaction after solder mask so as to ensure good soldering ofcomponent or no oxidation of copper surface for future use. Immersiongold has good surface evenness.
3. OSP: Alayer of metal protective film is applied on bare board of PCB by chemical reaction so as to ensure no oxidation of copper surfacebefore soldering. OSP has good surface evenness but poor solderingresistance.
4. Selective immersion gold:This is combination of immersion gold and OSP.
5. Immersion tin: Alayer of tin is immersed on bare copper of PCB by chemical reactionafter solder mask so as to ensure good soldering of components. Immersion tin has good surface evenness.
6. Immersion silver: Alayer of silver is immersed on bare copper of PCB by chemical reactionafter solder mask so as to ensure good soldering of components aftersolder mask. Immersion silver has good surface evenness. |  |
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