Types of material | Product description | Usagee | features |
GA-170 | High Tg 175℃(DSC)
| High reliable and High Tg Material for High multi-layers PCB, suitable for Lead Free Process.
| 1.Excellent thermal resistance and suitable for Lead Free process.
2.CAF resistance.
3.Low Z-CTE and excellent through hole. |
| High Tg 180℃(DSC)
| High reliable and High Tg Material for High-layers PCB, suitable for Lead Free Process.
| 1. Outstanding thermal resistance and suitable for Lead Free process.
2. Low Z-CTE and excellent through hole reliability.
3. Low water absorption and CAF resistance.
|
| High Tg 200℃(DSC)
| High reliable and High Tg Material for High-layers PCB, suitable for Lead Free Process.
| 1. Low dielectric constant and loss tangent.
2. Excellent electrical, chemical and thermal resistance properties.
|
| Tg 150℃(DSC) | For Multi-layer PCB ,suitable for Lead Free Process. | 1. Outstanding thermal resistance.
2. Suitable for Lead Free Process.
3. CAF resistance.
|
GA-170-D7 | High Tg 175℃(DSC) | High reliable and High Tg Material for multi-layer PCB.
| 1. Good thermal resistance.
2. Low Z-CTE and excellent through hole reliability. |
| |
