| High Tg 170℃(TMA)
Dk:3.6-3.8(1GHz)
Df:0.010-0.012(1GHz) | Low Dk and High Tg material for High-speed data communication equipment, suitable for Lead Free Process. | 1. Low dielectric constant and loss tangent.
2. Outstanding thermal resistance and suitable for Lead Free process.
3. CAF resistance.
4. Excellent dimensional stability,
through-hole reliability.
5. Excellent electrical and chemical resistance properties.
|
| High Tg 195℃(DSC)
Dk:3.6-3.8(1GHz)
Df:0.010-0.012(1GHz) | Low Dk and High Tg material for High-speed data communication equipment, suitable for Lead Free Process. | 1. Low dielectric constant and loss tangent.
2. Outstanding thermal resistance and suitable for
Lead Free process.
3. Excellent electrical and chemical resistance
properties.
|
