  | Shenzhen Fastprint Circuit Tech Co.,Ltd.Company Profile
In the 21st Century, modern information technology is developing rapidly. In order to advance in this highly competitive worldwide market, IT-related high-tech industries must adapt to increasing demand for flexibility, specialized end-user requirements, and supplying product that meets or exceeds multiple international standards. Entry into the high-end technology field and successfully competing in a global marketplace are the focus points of successful high-tech industrial enterprises.
FASTPRINT, positioned in 2006 to become Asia’s #1 supplier of high end, quick-turnaround PCB’s, provides services to domestic and overseas OEM’s, design service bureaus, R&D organizations and contract manufacturers. FASTPRINT currently has factories in Shenzhen and Guangzhou, distributing to local customers in Beijing, Shanghai, Shenzhen, Chengdu and Xi’an to cover the most important R&D centers in China. FASTPRINT has also set up a distributor in Hong Kong with a group of highly qualified employees serving customers in more than 30 countries worldwide.
Utilizing excellent management foresight, FASTPRINT has gained comprehensive praise and commendation from the industry. Supplying high-end technology product with fast and punctual leadtime, FASTPRINT is the first pure prototype factory to appear in the Top 100 Chinese electronic corporations. FASTPRINT is the primary approved prototype source for Huawei and ZTE Corporation, and also has existing relationships with GE, Agilent Technologies, Siemens, Jabil, Celestica, and Flextronics. FASTPRINT PCBs are applied worldwide in communications, network, industrial controls, computer applications, aerospace and medical products, and are also used in Chinese military applications.
FASTPRINT purchased multinational high-end manufacturing, measurement and inspection equipment from Germany, Italy, Israel and Taiwan to produce high layer count backpanels, HDI, high frequency, high Tg, RoHS compliant, impedance controlled rigid, flex and rigid/flex boards.
With our stable key production systems, PCB’s from 2-30 layers are fabricated with maximum dimensions up to 23 by 35 inches. Laser-direct imaging enables production of 3 mil track and spacing, and 2 mil cores produce layer counts in excess of 30 with aspect ratios up to 20:1, an excellent fit for high density test and interconnect boards. FASPRINT also produces high Tg (up to 180), high-frequency and hybrid (mixed-material) PCB’s. UV Laser drilling produces HDI 1+2+1 and 2+4+2 boards and via holes down to .004 finished. Surface treatments include Immersion gold, Immersion silver, Immersion tin, OSP, Lead-Free HASL, and selective plating techniques, satisfying the market demand for RoHS compliant product. All “green” product is certified by SGS.
Facing drastic market competition and global economics, FASTPRINT implements a strategy of “Customers First, Speed and Efficiency, Continuous Improvement, and Project co-development with the Customer” to move ahead of worldwide competition. Under the leadership of Board chairman Mr. Xingya Qu, FASTPRINT strives to create new PCB techniques and products, and implement faster service to satisfy customers. An efficient, integrated ERP system dramatically improves the transfer of information within departments. Quote requests and Engineering Questions are processed by our staff of 100 engineers within 4 hours’ time. CAM engineering services are available 24/7 via the Internet.
Today, the development of FASTPRINT is like a high-speed train, moving fast in the market economy. FASTPRINT takes on the mission to offer the fastest and highest quality and excellent service for the continuous improvement of electronic technology. We are not satisfied with our current achievements. Our goal is to be the best in the world at what we do.
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