Product Class : Electronic Material·PCB Material
Product Description
The PIC DF-170 is specially formulated to cope with the increasing stringent demand in high complexity, high layer count, lead-free PCB design and applications. This material is a high performance, high Tg, CAF resistant multi-functional epoxy resin. Product Features
• High glass transition temperature: > 170°C (measured by DSC)
• High decomposition temperature: > 350°C
• Low water absorbability
• Compatible with lead-free assembly environment - passed the lead-free reflow requirement at peak temperature of 260°C
• Excellent CAF resistance
• Able to withstand high thermal excursion during PCB fabrication and assembly
• Provide high thermal resistance and long term thermal reliability
• Wide operating window for multilayer processing
• Excellent thermal shock reliability
• Withstand stringent requirements of Accelerated Thermal Cycling and IST cycles
• UV blocking for maximum compatibility with automated optical inspection Applications
• High-layer count designs
• Backplanes
• High complexity multi-layers
• PC computers
• High-end servers
• Wireless communication infrastructure
• Automotive applications requiring high thermal resistance | 
