Product Class : Electronic Material·Ccl Plate Material
P-138 is a laminate with excellent dielectric properties, mechanical properties, chemical resistance and heat resistance, UV blocking and AOI compatible, having a Tg up to 135°C (DSC). Base material color: Yellow. It is applicable for double sided or multilayer printed circuit board with higher performances.
General Specifications(1) | Thickness(2)
Inch (mm) | Copper Cladding
oz (  m) | Size(3)
Inch (mm) | Rigid laminate | 0.0075 (0.2)
↓
0.125 (3.2) | 3/8 (12) 1/2 (18) 1 (35) 2 (70) | 36" x 48" (920x1220) 37" x 49" (940x1245) 40" x 48" (1020x1220) 41" x 49" (1045x1245) 42" x 48" (1070x1220) | Thin Core | 0.004 (0.1)
↓
0.040 (1.0) |
Property | Condition | Unit | Index | Typical value(4) | Glass transition temp Tg | DSC | °C | ≥ 135 | 138 | Surface resistance | After damp heat | C-96/35/90 | M Ω | ≥ 104 | 106 | At elevated temp | E-24/125 | ≥ 103 | 105 | Volume resistivity | After damp heat | C-96/35/90 | MΩ-cm | ≥ 106 | 107 | | ¡¡ | At elevated temp | E-24/125 | ≥ 103 | 105 | Permittivity at 1 MHz | C-24/23/50 | - | ≤ 5.4 | 4.2 | Loss tangent at 1 MHz | C-24/23/50 | - | ≤ 0.035 | 0.025 | Dielectric breakdown | D-48/50 | kV | ≥ 40 | 50 | Arc resistance | D-48/50 | sec | ≥ 60 | 110 | Peel strength (1oz) | As received | A | N/mm | ≥ 1.40 | 1.8 | | ¡¡ | After solder float | 288°C 20s | ≥ 1.40 | 1.8 | Flexural strength | Lengthwise | A | N/mm2 | ≥ 415 | 480 | | ¡¡ | Crosswise | A | ¡Ý 345 | 400 | Dimensional stability X-Y axis | E-0.5/170 | % | ≤ 0.05 | 0.015 | Water absorption | D-24/23 | % | ≤ 0.35 | 0.10 | Solder float at 288°C | A | sec | ≥ 20 | 120 | Flammability | E-24/125 | - | UL94V-0 | UL94V-0 |
1. Special requirements should be agreed by seller and buyer. 2. Thickness tolerance meets IPC-4101 3.8.4.2 B/L level. Rigid board meets L level, thin core meets B level. 3. Size available see (( GENERAL CHARACTERISTICS OF PIC COPPER CLAD LAMINATES (CCLs) )) -E. 4. Typical value based on a 0.059" 1/1 (1.5mm 1/1) laminate. |
