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Suzhou Fukuda Metal Co., Ltd.

Product Detail

Surface Treated Copper Foil for high density and thinner multi-layer board

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Description:
Product Class : Electronic Material·PCB Material
IPC-Grade 3
Product Name
T9B Matte Side Roughness Treated DSTF Drum Side Roughness Treated
Nominal Thickness µm121835 70 18 35 70
oz.1/31/21 2 1/2 1 2
Typical Properties






Applicable Standard
Thickness by Weightg/m2107151 285 575 151 285 575 IPC-4562 (JIS C 6515)
Tensile Strength






IPC-4562 (JIS C 6515)
2.1 at 23 ℃N/mm2400400 400 350 400 400 350
2.2 at 180 ℃200200 200 180 200 200 180
• Elongation







IPC-4562 (JIS C 6515)
3.1 at 23 ℃%1010 15 20 10 15 20
3.2 at 180 ℃55 5 5 5 5 5
4.Untreated side profileµm0.25 (Ra)0.25 (Ra) 0.25 (Ra) 0.25 (Ra) 3.5 (Rz) 6.0 (Rz) 10.0 (Rz) JIS C 6515
5.(Rz)
Surface treated side profile
µm6.0 7.0 9.0 13.0 4.5 4.5 4.5 JIS C 6515
6.Peel Strength (by FR-4)






(FR-4 Tg 140 ℃ )
6.1 Condition AN/mm1.00 1.40 2.00 3.00 1.20 1.60 2.20 A
6.2 After Solder Float1.00 1.40 2.00 3.00 1.20 1.60 2.20 S-4
6.3 After Baking0.85 1.20 1.70 2.50 1.05 1.35 1.90 E-48/180
6.4 At Elevated Temperature0.80 1.15 1.65 2.50 1.05 1.35 1.90 at 125 ℃
6.5 After Boiling TestDegradation rate<10 <10 <10 <10 <10 <10 <10 D-2/100
6.6 After Exposure to HCl Sol.<2 <2 <2 <2 <2 <2 <2 18% 25 ℃ 60min
7.SolderabilityGood IPC-4562
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